Power & Compound Semiconductor International Forum 2018  
Date: March 15-16, 2018
Venue: Pudong Ballroom4, 3F, Pu dong Kerry Hotel, No.1388 Hua Mu Road Pu dong, Shanghai
Chinese and English Simultaneous Interpretation will be provided

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The "Power & Compound Semiconductor International Forum 2018", which is one of the largest professional event about power and compound semiconductor industry in Asia, will be organized in conjunction with SEMICON China 2018 on Mar.15-16, 2018 in Kerry Hotel at Shanghai.
The Forum is a two-day program and contains 4 sessions: Wide Band Gap Power Electronics, Optoelectronics, Compound Semiconductor in Communications, and Emerging Power Device Technology.

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Day1-Mar.15th, 2018

08:30-09:15AM Registration / 注册
   
09:20-09:30AM
 Welcome Remark / 欢迎致辞
Lung Chu 居龙
President, SEMI China
SEMI中国，总裁
   

Opening Keynote Speech / 开幕主旨演讲

   
Moderator / 主持人：
Naiqian Zhang 张乃千
President of Dynax Semicondutor, Inc.
苏州能讯高能半导体有限公司，总裁
   
09:30-10:00AM
 GaN Transistors – Giving New Life to Moore's Law
氮化镓晶体管-赋予摩尔定律新生
Alex Lidow
CEO of EPC (Efficient Power Conversion)
美国宜普电源转换公司，首席执行官
   
10:00-10:30AM
 Advances in Power Supply Efficiency and Density Through GaN Integration
大幅提高功率电子效率及密度GaN的新技术
Dan Kinzer
CTO, Navitas Semiconductor
纳微半导体，首席技术官
   
10:30-11:00AM
 Compound Semiconductors - Unleashing the Power
大放异彩的化合物半导体
Drew Nelson
CEO, IQE
IQE，首席执行官
   
11:00-11:30AM
 Micro LED : Real Revolution for Display Industry
Micro LED ：终极显示技术
Charles Li 李允立
CEO, Playnitride
錼创科技，首席执行官
   
11:30-13:30 Break
休息
   
   

*Session: Optoelectronics / 光电

   
Moderator / 主持人：
Aris Ma 马铁中
CEO, AK Optics Technology Co. Ltd
昂坤科技，首席执行官
   
13:30-14:00
 GaN-Based VCSEL; Its Latest Progress and Potential Applications
氮化镓VCSEL的最新进展及其潜在应用
Tatsushi Hamaguchi
Researching Team Leader, Sony corporation
索尼公司，研发带头人
   
14:00-14:25
 The Current Situation and Future Development of the Patterned Sapphire Substrate (PSS) for LED
LED用图形化蓝宝石衬底的现状与未来
Kai Kang 康凯
CEO, SINOPATT Technology
中图科技，总经理
   
14:25-14:50
 Laser Diodes Deliver Next Generation 3D Sensing Capabilities
激光二极管提供下一代3D感测功能
Dr. Andre Wong
Senior Director, Product Line Management, Lumentum
美国Lumentum公司，产品线管理高级总监
   
14:50-15:15
 The Application of High Density ICP Etch Equipment in Compound Semiconductor Devices Manufacture
高密度ICP Etch 设备在化合物半导体器件制造中的应用
Yang Meng 杨盟
Product Director and Deputy GM of Etch Product Division, Etch Product Division, Beijing NAURA Microelectronics Equipment Co., Ltd.
北京北方华创微电子装备有限公司，刻蚀事业部副总经理
   
15:15-15:30 Tea Break
茶歇
   
   

*Session: Compound Semiconductor in 5G Communications / 化合物半导体与5G通讯

   
Moderator / 主持人：
Brian Lee 李宗鴻
Chief Strategy Officer, WIN Semicondutors Corporation
穩懋半導體股份有限公司，策略長
   
15:30-15:55
 GaN Device for 5G Communication Era
5G通讯时代的氮化镓器件
Yi Pei 裴轶
Director of Device Technology, Dynax Semiconductor
能讯高能半导体，器件技术总监
   
15:55-16:20
 GaN on Si: Primed for RF Power
硅基氮化镓：为射频功率做好准备
Dr. Markus Behet
Chief Marketing Officer, EpiGaN
比利时 EpiGaN公司，首席市场官
   
16:20-16:45
Compound Semiconductor Applications to Future 5G Cell Phone and Power Management Systems
化合物半導體對於未來五G手機及電源管理系統的應用
Barry Lin 林嘉孚
CTO, WAVETEK
聯穎光電股份有限公司，首席技术官
   
16:45-17:10 Third Generation of Semiconductors Device for Power and RF Application
第三代半导体器件的功率与射频应用
Wu Jia 仵嘉
Director, HUAWEI
华为技术有限公司，总监
   

Day2-Mar.16, 2018

*Session: Wide Band Gap Power Electronics / 宽禁带功率电子

   
Moderator / 主持人：
David Xiao 肖国伟
CEO of APT Electronics
广东晶科电子股份有限公司，CEO
   
09:00-09:30AM
 Current Status and Prospect of GaN-on-Si Power Devices and its Applications
硅基GaN功率电子器件的开发与应用的现状及展望
Shunfeng Li 李顺峰
Vice President, Sinopower Semiconductor, Inc.
江苏华功半导体有限公司，副总裁
   
09:30-10:00AM
GaN and SiC Semiconductor Production Technologies for Efficient Power Electronics
高效电力电子的GaN和SiC半导体生产技术
Frank Wischmeyer
Vice President Marketing and Business Development Power Electronics, AIXTRON SE
   
10:00-10:30AM
 CMOS Compatible GaN HEMTs on 200mm Wafers
CMOS在200毫米 GaN HEMTs器件上的运用
Steve Lester
Chief Technical Scientist, ExaGaN
法国 ExaGaN公司，首席科学家
   
10:30-11:00AM GaN-on-Si for RF and Power Electronics: from Lab to Fab
从实验室向产线进阶的硅基氮化镓射频与电力电子
Wang Ronghua 王荣华
Vice President of Technology, Xinguan Technology
大连芯冠科技有限公司，技术副总
   
11:00-11:30AM
 Innovative SiC MOSFET of Hestia Power and its Applications
新型碳化硅MOSFET產品與其應用介紹
Chwan-Ying Lee
CEO, Hestia-Power
   
11:30-13:30 Break
休息
   
   

*Session: Emerging Power Device Technology / 新型功率器件

   
Moderator / 主持人：
Bruce Lee 李博
President of Jiangsu Sinopower Semiconductor Co., LTD
江苏华功半导体有限公司，总裁
   
13:30-14:00
 Advances in Silicon Power Semiconductor Device Technology
硅功率半导体器件技术的发展
Madhur Bobde
Vice President, Device Technology, AOS
万国半导体，副总裁
   
14:00-14:30
 Device and Packaging Technology for Higher Power and Higher Reliability Application
针对大功率和可靠性应用的器件和封装技术
Makan Chen 陈马看
Senior Technical Sales Manager, ABB Switzerland Ltd
ABB瑞士，高级技术销售经理
   
14:30-15:00
The Adavantages of 3-in-1 Induction Motor with SiC Inverter Technology
三合一感应电机和碳化硅电控之优势
Jeremo Cao 曹祐铭
CEO of RevoDeve Power Train
大革动力系统，首席执行官
   
15:00-15:30
A Standardized Foundry Process for Silicon Photonics and Future Integration
一个标准化的硅光子学和未来集成的铸造工艺
Dasheng Fang
FAE & Sales Manager, Towerjazz
   
15:30-16:00 SiC Power Device Technology and Application in Electrified Railway
SiC 功率器件技术及其在电气化轨道交通中的应用
Guoyou Liu 刘国友
Vice Chief Engineer, CRRC Zhuzhou Semiconductor
株洲中车时代电气股份有限公司，副总工程师
   
16:00-16:40
 Closing Keynote 闭幕演讲
Advanced Power Modules for Power Electronics in Electrified Automotive
电气化汽车电力电子的先进功率模块
Gourab Majumdar
Senior Fellow of Mitsubishi Electric Corporation, Japan
日本三菱电机，Senior Fellow
   
16:40-17:00 Lucky Draw 幸运抽奖
   
   
Two-day registration fee:
Type Before Feb.12 with Advanced Payment(Early Bird) After Feb.12 and On-site
Attendees RMB 1,000 per person RMB 1,500 per person
Speakers Free Free
* Lunch is not included
* Agenda is subject to change

For more information and market promotion opportunities 关于论坛更多信息及市场宣传机会

Daniel QI 戚发鑫
Chief Analyst | Industry Research and Consulting (首席分析师 | 产业研究与咨询部)
Director | Power and Compound Semiconductor Industry; Industry Standards(项目总监 | 功率及化合物半导体产业；产业标准发展)
Tel: 86-21-60278576 ; Email: fqi@semi.org