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Conference Plenary Speaker (2024)
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Evolution of Moore's Law: a Perspective
Dr. Peng Bai, CEO, Rong Semiconductor
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New Materials vs New Geometries in Electronic Devices
Prof. John Robertson, Emeritus Professor of Electronic Engineering at Cambridge University, UK
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Integrated Module Approach to Solutions in the Specialty Device Market
Dr. Michael Chudzik, VP of Technology, IMS ICAPS & Packaging Semiconductor Products Group, Applied Materials
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50 Years of Silicon Retina History
Prof. Tobias Delbruck, Professor in Neuromorphic Engineering, Institute of Neuroinformatics, Switzerland
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MEMS - Sustainable Technologies for a Sustainable World
Dr. Giorgio Allegato MEMS Technology R&D Director
Analog, MEMS and Sensor Group - STMicroelectronics
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Partial List of Confirmed Distinguished CSTIC 2024 Keynote & Invited Speakers
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Enhance Chip Connectivity and Functionality through RRAM-based Monolithic 3D Integration
Jianshi Tang, Tsinghua University
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A Full Spectrum of Computing-In-Memory Technologies
Zhong Sun, Peking University
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All-dielectric metasurfaces for vortex generation and Detection
Shumin Xiao, Harbin Institute of Technology
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2D devices and in-sensor computing
Feng Miao, Nanjing University
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Defect Tolerant Physics-inspired Computing in Memristor Arrays
Can Li, University of Hong Kong
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Single Element Switch
Min Zhu, Shanghai Institute of Microsystem and Information Technology
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High endurance field-effect transistor memory based on Hafnium-oxide ferroelectrics
Kechao Tang, Peking University
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Implementation of Spintronic MRAM Circuits and Systems
Hao Cai, Southeast University
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SRAM based Compute-in-Memory Circuits Design for CNN and Transformers
Xin Si, Southeast University
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2D Material Devices for Advanced Computing
Han Wang, University of Hong Kong
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Recent progress of EUV Chemically Amplified Resist with Negative-Tone Development (CAR-NTD) for improving Chemical Stochastic
TORU FUJIMORI, FUJIFILM Corporation
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Innovated Methodology Improving CD Uniformity for Lithography Using Wafer-less Dynamic Grouping Process Characteristics
Yong-Qiang Che, Semiconductor Manufacturing Beijing Corporation
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The Spin-on Multi-Layer Material Status for Advanced Device
Satoshi Dei, JSR Electronic Materials
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From Tape to Mirrors: 50 Years of Progress in Photomask Technology
Chris Progler, Photronics
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Enhancing High-throughput and High-precision CD-SEM Metrology Through Advanced Deep Learning-Based Image Processing
Bo Wang, Hitachi High-Tech Corporation
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How Process, Equipment, Material, Computation that work together to make up the Performance of Photolithography
Qiang Wu, Fudan University
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Novel Etch Solution with Sym3 for Logic BEOL Patterning Etch Applications
Hui Sun, Applied Materials
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Plasma and radical etch patterning for 3D structures
Jiayang Li, Fudan University
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Challenges of Inductively Coupled Plasma Applications
Hu Zhou, AMEC
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New development of ICP etching for advanced patterning
Zhongwei Jiang, Naura, China
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Plasma etching solutions for compound semiconductors
Yali Fu, Naura, China
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New Materials and New Functionalities Co-work scaling, and the Exploration of Inner Spacer Technique
David Xiao, Qianmo Micros Design LLC
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Review of Advanced Ion Beam Etch Technology: Asymmetrical and Directional Approach
Yuxin Yang, Jiangsu Leuven Instruments Co., Ltd.
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The challenges and new developments on TSV etch applications
Guorong Li, Beijing NAURA Microelectronics Equipment Co., Ltd.
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The Progress and Challenges of Large Scale Integration of Silicon Photonics
Jin Guo, CUMEC
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The effect of stress on HfO2-based ferroelectric thin films
Feng Luo, Nankai University
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Do we need 300mm GaN?
Kai Cheng, Enkris Semiconductor,Inc
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Thin Film Atomic Layer Deposition and Selective Processes
Rong Chen, Huazhong University of Science and Technology
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Hetero-integration of Gallium Oxide Enabling Bipolar Design and Thermal Management
Jiandong Ye, Nanjin University
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Tailoring the deposition and composition of advanced oxide and SiCN films to deliver the highest bonding energy for fusion and hybrid bonding applications
Zongbin Wang, Applied Materials
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A Chemistry Perspective of ALD Precursors' Properties
Xiabing Lou, Suzhou Origin Materials Technology Co,. Ltd
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Design Technology Co-Optimization for Yield and Reliability Enhancement of RRAM Technology Platform
Zhichao Lv, Reliance Memory
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Si based GaN HEMTs/System R&D and the perspective of the technological commercialization
Hongyu Yu, Southen University of Science & Technology
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Advances and Reliability Challenges in Heterogeneous Integration in Chiplet Era: from Solder to Copper to Optical Interconnects
Zhuo-Jie Wu, HFC semiconductor
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Modeling of Endurance Degradation of Anti-ferroelectric Hf1-xZrxO2 Capacitor
Yi Zhao, Zhejiang University
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SiGe/Si Heteroepitaxial Epitaxy and Characterization for CMOS and Vertically Stacked DRAM
Guilei Wang, Beijing Superstring Academy of Memory Technology
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A Review in III-Nitride Nanocolumns Growth and Applications
Enrique Calleja, Universidad Politécnica de Madrid(UPM)
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CMP Equipments and Application Technologies for Advanced Manufacturing Process
Xinchun Lu, Tsinghua University
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Study on the Processing Characteristics and Polishing Technology of Easily Cleavable Gallium Oxide Crystals
Hai Zhou, Yancheng Institute of Technology
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Research on the electro-fenton magnetorheological finishing technology for GAN wafer
Qiusheng Yan, Guangdong University of Technology
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From Good to Great: The Power of Advanced ILD CMP Slurries in Boosting Performance
Juliane Hitzel, Advanced NanoSurface Technologies Co., Ltd.
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CMP Technology for More than Moore Innovation
Haedo Jeong, Pusan National University
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CMP characteristics of IGZO thin film with a variety of process parameters
Ming Zeng, Beijing Superstring Academy of Memory Technology
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Mechanism Research and Improvement of AL Scratch Defect Based on MG CMP
Qingqing Duan, Shanghai Huali Integrated Circuit Corp.
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New methodology for anisotropic nanoparticles characterization by polarization light scattering: length and diameter determination of rod-like nanoparticles
David Jacob, Cordouan Technology
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The development progress of new high-efficiency silicon carbide substrate polishing slurry
Xiuyan Sun, Founder of Zhangjiagang Anchu Technology Ltd.
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Ceria slurry applications to STI, ILD, and advanced packaging CMP
Yuchun Wang, Anji microelectronics
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Doping level detection in Si or SiGe via In-Line Raman Spectroscopy
Roy Pinhassi, Nova Ltd
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Assessing the Power-Awareness of VLSI Testing
Xiaoqing Wen, Kyushu Institute of Technology, Japan
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Polymorphic circuits design and applications in security
Gang Qu, University of Maryland, USA
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Signal and Power Reliability for Integrated Chips and Chiplets
Lei He, UCLA, USA
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Jitter reduction for multi-GHz ATE up to 20 GHz
Dave Keezer, Eastern Institute for Advanced Study (EIAS), China
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MI's solutions for next era
Byoung-Ho Lee, Hitachi High-Tech Corporation
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Scaling of Memory Performance and Capacity with Memory Processor
Fei Wang, Shandong University
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Study on ELK Dielectric Reliability During the Solder Reflow Process Based on Finite Element Simulations
Jialin Zheng, Sanechips Technology Co., Ltd.
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Heterogeneous Integration Ecosystem: The Critical Path to the Success of 3D SOC(SOH)
Eason Wang, ICLeague
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Study of Defects in Advanced Packing at the Atomistic Scale by Using In Situ TEM
Xing Wu, East China Normal University
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The Solution and Challenge of Glass Core Substrate Technology
Tingyu Lin, Guangdong FoZhiXin (FZX) Microelectronics Technology Research Co. Ltd
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Breaking Memory Wall with SeDRAM® Technology in Chip Level
Yue Zhou, Xi'an UniIC Semiconductors Co., Ltd.
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Chiplets and Advanced Packaging for Future Computing (Tentative)
Terry Wu, Samsung Electronics
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Antimonide semiconductor material for infrared sensing
Donghai Wu, Institute of Semiconductors, CAS
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Si based GeSn materials and devices
Chuanbo Li, Minzu University of China
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A GHz Silicon-based Width Extensional Mode MEMS Resonator with high Q
Jinling Yang, Institute of Semiconductors, CAS
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XOI materials
Xin Ou, Shanghai Institute of Microsystem and Information Technology, CAS
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MEMS Acoustic Device
Songsong Zhang, Chengdu Xiansheng Technology/SITRI
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Lamb Acoustic Wave Device for RF applications: Ready for Prime Time Challenges and Applications?
Songbin Gong, Spectron Tech/UIUC
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NEMS based on novel vdW heterostrucutres
Zheng HAN, Shanxi University
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Universal Materails and Device Integration Technology for Future Chips
Chen Wang, Tsinghua University
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High-mobility 2D P-type semiconductor materials
Xiang Chen, Nanjing University of Science & Technology
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Atomically sharp interface of van der Waals heterostructures enabled high-performance electronic devices
Lihong Bao, Institute of Physics, CAS
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Controllable preparation of wafer-scale two-dimensional van der Waals heterostructures
Libo Gao, Nanjing University
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Advancing 3D Nano-electronic Systems through Innovations in BEOL-Compatible Oxide Semiconductor Technology
Gong Xiao, National University of Singapore (NUS)
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Advanced spectral sensing methods for process monitoring applications
Ray Saupe, Fraunhofer ENAS
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A Journey of High-Density Associative Memories based on Ferroelectric Content Addressable Memories
Xunzhao Yin, Zhejiang University
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Algorithm and Hardware Codesign for Brain-inspired Neuromorphic Computing
Aili Wang, Zhejiang University
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Ultra-broadband RF Front-end SoC using 0.18um CMOS Technology
Jianguo Ma, Zhejiang Lab
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Logic Synthesis based on Semi-tensor Product of Matrices
Zhufei Chu, Ningbo University
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Efficient and Robust Hardware for Neural Networks
Li Zhang, Technical University of Darmstadt
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Optimizing Architecture and Algorithm for Privacy-Preserving
Jongeun Lee, Ulsan National Institute of Science and Technology (UNIST)
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Navigating Aging Effects: Concepts and Implementation in Reliable Computing Systems
Yu-Guang Chen, National Central University
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Photonic-Electronic Design Automation
Jiang Xu, Hongkong University of Science and Technology
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Ultra Low Power Connectivity SoC for IoT
Peter Gammel, UBILITE
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Machine Learning for Device Modeling (MLDM) in the DTCO Eco-system
Lining Zhang, Peking University
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Diffusive/Quantum Carrier Transport and Multiphysics Simulation Methods of Advanced Electronic/Optoelectronic Devices
Wenchao Chen, Zhejiang University
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Design Technology Co-Optimization Methods for Advanced Logic Nodes
Xingsheng Wang, Huazhong University of Science and Technology
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Exploring AI-in-the-Loop For Physical Design Verification DFM/DTCO EDA
Yongfu Li, Shanghai Jiao Tong University
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Scale-out Chiplet-based Systems: Architecture, Design and Pathfinding
Puneet Gupta, University of California at Los Angeles
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Logic Locking over TFHE for Securing User Data and Algorithms
Masanori Hashimoto, Kyoto University
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In-memory Computing and Dynamic Vision Sensors: Recipes for tinyML in Internet of Video Things
Arindam Basu, Hongkong City University
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Neuromorphic Audio Edge Intelligence
Shih-Chii Liu, University of Zurich and ETH Zurich
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Vector Matrix Multiplication with Two-Dimensional Materials
Mario Lanza, KAUST
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AI Empowers Semiconductor Yield Signoff Ecosystem - Reducing Cost and Increasing Efficiency for Manufacturing with a Diversified Supply Chain
Mark Lu, Semitronix Corporation
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Deep Neural Network Proxy Modelling for IC Virtual Fabrication
Dong Ni, Zhejiang University
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Heterogeneous integration of analog and digital computing-in-memory technologies
Shaodi Wang, WITMEM Co. Ltd
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Depth-first convolution-neural-network pipeline for compute-in-memory architecture
Cimang Lu, Flash Billion
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Nonvolatile emerging memory devices for energy-efficient edge AI
Daniele Ielmini, Politecnico Di Milano
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Progress of AI for EDA Algorithms
Yu Han, Empyrean Technology Co., Ltd.
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Novel Data Storage Technology for AI
Xiangshui Miao, Huazhong University of Science and Technology
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The Application of Virtual Manufacturing in IC Process Development
Yunlong Li, Zhejiang ICsprout Semiconductor Co., Ltd.
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Large Scale VLSI Mask Optimization
Bei Yu, The Chinese University of Hong Kong
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The Integration of AI Large Model & Neuromorphic Computing in Memory with High Speed Analog ICs
Hongjie Liu, Shenzhen Reexen Technology Co., Ltd.
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Research on the application of artificial intelligence in device compact model and technology – circuits co-optimization
Ye Lu, Fudan University
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Developing a Neuromorphic Computer: Practices and Challenges
Gang Pan, Zhejiang University
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Snapdragon Platform for High Performance 5G Mobile SOC & AI/Computing Application Manufactured with 4nm EUV Fin-FET Technology and Beyond
Jun Yuan, Qualcomm
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