Symposium III Dry &Wet Etch and Cleaning

Committee Members

International Advisory Committee Members

	Dr. T. C. Chen Chairman IBM Fellow and VP, IBM T.J. Watson Research Center, USA
	Dr. Minhwa Chi Co-Chair Senior VP, SMIC
	Dr. Philip Wong Co-Chair Stanford University, USA
	Dr. Swami Mathad Co-Chair Tech Consulting, USA
	Dr. Georg Bednorz Member IBM Fellow, Nobel Laureate, Switzerland
	Dr. Qingyuan Han Member Hans Consulting International, USA
	Dr. Kinam KIM Member President and CEO, Samsung Institute of Advanced Technology, Korea
	Mrs. Ying Shi Member ICMTIA, China
	Dr. Hsing-Huang Tseng Member Texas State University
	Dr. Hailing Tu Member GRINM, China
	Dr. Shichang Zou Member Chinese Academy of Sciences, China
	Dr. Edward Y. Chang Member National Chiao Tung University, Taiwan, China

Steering Committee Advisors

	Mr.Lung Chu President，SEMI China Vice President，SEMI
	Dr. Hiroshi IWai Member Tokyo Institute of Technology, Japan
	Dr. Tomi T. Li Member National Taiwan Central University
	Dr.David Huang Member Pall Inc. USA

Conference Chair and Co- Chairs

	Dr. Ru Huang Chairwoman Peking University, China
	Dr. Cor Claeys Co-Chair IMEC, Belgium
	Dr. Hanming Wu Co-Chair SMIC, China
	Dr. Qinghuang Lin Co-Chair IBM, USA
	Dr. Steve Liang Co-Chair Jiangsu Changjiang Electronic Technology Co., Ltd, China
	Dr. Peilin Song Co-Chair Publicity IBM, USA
	Mr. Zhen Guo Co-chair Intel, USA

Symposium Chair:

	Dr. Ru Huang Chairman Peking University, China
	Dr. Kafai Lai Chairman IBM, USA
	Dr. Ying ZHANG Chairman Applied Materials, USA
	Mr. Zhen Guo Chairman Intel, USA
	Dr. Yuchun Wang Chairman Anji Microelectronics, China
	Dr. Peilin Song Chairman IBM, USA
	Dr. Steve Liang Chairman Jiangsu Changjiang Electronics Technology Co., Ltd, China
	Dr. Qinghuang Lin Chairman IBM, USA
	Dr. Yiyu Shi Chairman Missouri University of Science and Technolog, USA
	Dr. Hsiang-Lang Lung Poster Chairman Macronix International Ltd., Hsinchu, Taiwan

Symposium I: Device Engineering and Technology

	Dr. Ru Huang Chairwoman Peking University, China
	Dr. Cor Claeys Co-Chair IMEC, Belgium
	Dr. Minhwa Chi Co-Chair Senior VP, SMIC
	Dr. Chung Lam Co-Chair Principle Engineer, IBM, USA
	Prof. Jong-Ho Lee Member Seoul National University, Korea
	Dr. Ming Liu Co-Chair IME, CAS, China
	Dr. Yimao Cai Member Peking University, China
	Dr. Shaoning Mei Member Wuhan Xinxin Semiconductor Manufacturing Corp
	Wensheng Qian Member Director, HHGrace
	Dr. Huiling Shang Member TSMC
	Dr. Zhiqiang Wei Member Panasonic, Japan
	Dr. Hong Wu Member SMIC, China
	Dr. Huaqiang Wu Member Microelectronics, Tsinghua University, Beijing, China
	Dr. Frank Bin Yang Member Qualcomm, USA
	Dr. Huilong Zhu Member IME, CAS, China

Symposium II: Lithography and Patterning

	Dr. Kafai Lai Chairman IBM, USA
	Dr. Ken Wu Co-Chair SMIC, China
	Dr. Linyong (Leo) Pang Co-Chair VP. D2S Inc.
	Mr. Ma Xiaoming Member Dow Chemical
	Dr. Zhimin Zhu Member Brewer Science, USA
	Dr. Zhibiao Mao Member Huali Semiconductor Manufacturing Company, China
	Dr. Yayi Wei Member Chinese Academy of Science
	Motokatsu.Imai Member SEAJ (Semiconductor Equipment Association of Japan)
	Shiyuan Liu Member Huazhong University of Science and Technology , China
	Hai Deng Member Fudan University, China
	Dr.Yuyang Sun Member Mentor Graphics,USA
	Wang Yueh Member Intel OR, USA

Symposium III: Dry &Wet Etch and Cleaning

	Dr. Ying ZHANG Chairman VP, Applied Material, USA
	Dr. Maxime Darnon Co-Chair French Institute for Scientific Research (CNRS), France
	Dr. Yue Kuo Co-Chair Texas A&M University, USA
	Dr. Tom Ni Member AMEC, China
	Mr. Jinrong Zhao Member North Microelectronics, China
	Dr. Sebastian Engelmann Member IBM T.J.Watson Research Center, USA
	Dr. George Totir Member IBM T.J.Watson Research Center, USA
	Dr. Masahiro Sumiya Member Hitachi High-Technologies Corp., Japan
	Dr. Denis Shamiryan Member Global Foundries, USA
	Dr. Steven Zhang Member SMIC, China
	Dr. Kaidong Xu Member IMEC, Belgium

Symposium IV: Thin film, Plating and Process Integration

	Dr. Zhen Guo Chairman Intel, China
	Dr. Beichao Zhang Co-Chair SMIC, China
	Mr. Xiaoping Shi Co-Chair IMEC, Belgium
	Dr. Chao Zhao Co-Chair IME, CAS, China
	Dr. Huang Liu Co-Chair Global Foundries, USA
	Dr. Jiang Yan Co-Chair Institute of Microelectronics, CAS
	Dr. Ran Liu Co-Chair Fudan University, China
	Dr. Sowmya Krishnan Co-Chair SEMITRAC, USA
	Dr. Jason Tian Member Nikon Precision, China
	Dr. Jon REID Member Novellus, USA
	Prof. Yu-Long Jiang Member Fudan University, Shanghai
	Dr. Li-Qun Xia Member AMAT, USA
	Dr. Julian Hsieh Member ASM, Taiwan
	Dr.Chih-Chao Yang Member IBM Research
	Dr. Jianhua Ju Member Assistant Director, SMIC Tech R&D
	Dr. Massayasu Tanjyo Member Nissin Ion Equipment, Japan
	Dr. Ganming Zhao Member Applied Materials
	Dr. Zheyao Wang Member Tsinghua University, China
	Dr. Da Zhang Member Higon, USA
	Dr. Larry Zhao Member Lam Research, USA
	Dr. Jiaxiang Nie Member Lam Research, China

Symposium V: CMP and Post-Polish Cleaning

	Dr. Yuchun Wang Chairman Anji Microelectronics, China
	Dr. Jingxun Fang Co-Chair Huali Microelectronics Corporation, China
	Dr. Kuochun Wu Co-Chair Cabot Microelectronics, Asia
	Dr. Paul-Chang Lin Co-Chair SMIC, China
	Dr. David Huang Member Pall Corporation, USA
	Dr. Jin-Goo Park Member Hanyang University, Korea
	Dr. Kailiang Zhang Member Tanjin University of Science & Technology, China
	Dr. Mahadevaiyer Krishnan Member IBM, USA
	Dr. Shoutian Li Member Anji Microelectronics, China
	Dr. XinChun Lu Member Professor,Tsinghua University , China
	Dr. Wen-Chiang Tu Member Applied Materials, USA

Symposium VI: Metrology, Reliability and Testing

	Dr. Peilin Song Chairman IBM, USA
	Dr. Baozhen Li Co-Chair IBM System and Technology Group, USA
	Dr. Frank Feng Member Mentor Graphics Corporation, America
	Dr. Yiping Xu Member Sr.Vice President ahd CTO,Raintree Technologies Corp
	Dr. Yuhua Cheng Member Peking University, China
	Dr. Francis Jen Member KLA Tencor, China
	Dr. Kelvin Xia Member Advantest, China
	Dr. Srinivas Raghvendra Member Synopsys, USA
	Dr. Xiaowei Li Member Chinese Academy of Sciences
	Dr. Yu Huang Member Mentor Graphics, USA
	Dr. Jian-fu Zhang Member Liverpool John Moores University, England
	Dr. Houken Tseng Member Teradyne, Greater China,China
	Dr. Huaguo Liang Member Hefei University of Technology, China

Symposium VII: Packaging and Assembly

	Dr. Steve Liang Chairman Jiangsu Changjiang Electronics Technology Co., Ltd, China
	Dr. Yifan Guo Co-Chair VP of Engineering ,ASE Shanghai
	Dr. Huili Fu Co-Chair Chief Packaging Expert,HiSilicon
	Dr. Wenhui Zhu Member Professor,Central South University
	Dr.John Rowland Member VP of Engineering,Spreadtrum
	Dr. Roy Yu Member IBM, Watson Research Center, USA
	Dr. Yishao Lai Member ASE. Taiwan, China
	Dr. Jing Shi Member Oracle, USA
	Dr. Young Do Kweonbr Member Samsung, Korea
	Prof. Mingliang Huang Member Dalian University of Technology, China
	Dr. Renzhe Zhao Member Huawei, China
	Dr. Mark Huang Member SUZHOU SPEED SEMICONDUCTOR, CHINA
	Dr. Dan Tracy Member SEMI, USA
	Dr. John Yuanlin Xie Member Altera Corp., San Jose, CA, USA
	Dr. Hong SHI Member Xilinx
	Dr. Tim Bao Member Air Products and Chemicals
	Dr. Tim Chen Member Yantai Darbond Technology Co., Ltd.
	Dr. Daniel Lu Member Henkel

Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies

	Dr. Qinghuang Lin Chairman IBM, USA
	Dr. Hyungjun Kim Co-Chair Yonsei University, South Korea
	Dr. Hsiang-Lang Lung Co-Chair Macronix International Ltd., Hsinchu, Taiwan
	Dr. Jingwei Bai Member Tsinghua University, China
	Dr. Edward Y. Chang Member National Chiao Tung University, Taiwan, China
	Kangguo Cheng Member IBM, USA
	Dr. Jinn P. Chu Member National Taiwan University of Science and Technology, China
	Thomas Otto Member Acting Director of the Fraunhofer Institute for Electronic Nano Systems ENAS Chemnitz, Germany
	Dr. Zheyao Wang Member Tsinghua University, China
	Dr. Daniele Lelmini Member Politecnico Di Milano, Italy
	Wei Wang Member Peking University, China
	Dr. Fuhua Yang Member Institute of Semiconductor, Chinese Academy of Sciences, China
	Dr. Wang Yueh Member Intel, USA

Symposium IX: Circuit Design, Systems and Applications

	Dr. Yiyu Shi Chair Assistant Professor, Electrical and Computer Engineering Department, Missouri University of Science and Technolog, USA
	Dr. Dong Chen Co-Chair IBM T.J. Watson Research Center, USA
	Dr. Wenjian Yu Co-Chair Associate Professor, Department of Computer Science and Technology, Tsinghua University, China
	Dr. Jinjun Xiong Member, IBM T.J. Watson Research Center, USA
	Mr. Guanming Huang Member, Synopsys Inc, USA
	Dr. Pingqiang Zhou Member Shanghai Tech University
	Dr. Masanori Hashimoto Member Osaka University, Japan
	Dr. Tsung-Yi Ho Member National Cheng Kung University, Taiwan
	Dr. Weikang Qian Member University of Michigan-Shanghai Jiao Tong University Joint Institute, China
	Dr.Haizhou Yin Member IME, CAS, China
	Dr. Guangyu Sun Member Peking University, China
	Dr. Zhiru Zhang Member Assistant Professor, School of Electrical and Computer Engineering, Cornell University, USA

Symposium X: Si Materials and Photovoltaic Technology

	Prof. Frank Liu Chair Shanxi Normal University, China
	Dr. David Huang Co-Chair Pall Inc,USA
	Dr. Qi Wang Co-Chair GCL SI
	Dr. Qiang John Co-Chair GCL Executive,China
	Dr. Yuepeng Wan Member LDK Solar, China
	Dr. Liang Wu Member GCL Applied Industrial Research Institute Ltd
	Dr. Ray Lian Member Solabuzz, China
	Prof. Meng Tao Member Arizona State University, USA
	Dr. Zhigang Rick Li Member Researcher, DuPont, USA
	Prof. Paul R. Berger Member Ohio State University, USA
	Dr. Chris Lv Member Trina Solar, China

Contact Us

Kelly Zhang, SEMI China Tel: 86.21.6027.8556 Fax: 86.21.6027.8511 Email: kzhang@semi.org

Stacy Zhang, SEMI China Tel: 86.21.6027.8552 Fax: 86.21.6027.8511 Email: szhang@semi.org